Budget: 1000 UAH Deadline: 1 day
Good Morning Oleg!
I can help with this task!
Even with production if necessary.
Congratulations to Alexis!
Budget: 1000 UAH Deadline: 1 day
Good Morning Oleg!
I can help with this task!
Even with production if necessary.
Congratulations to Alexis!
It is necessary to manufacture an aviation wing, I will provide the drawing or 3D model. I am considering materials such as: aluminum - extrusion or covered frame, carbon fiber composite materials your option.
It is necessary to design a mechanism for the remote opening of hopper lids (railway grain car) at an operating elevator. The unloading area has a roof and allows for unloading on 2 tracks simultaneously. The system must move from both sides of each track and have dimensions of 60 cm in width (there is a separation system that does not allow exceeding the specified dimensions). The system must be installed and move exclusively along the floor along the track and the movement of the cars (a suspended system cannot be implemented). The power supply is electric 380-220V, and the actuators can be either electric or hydraulic; pneumatics are not considered. The mechanisms for opening the lids have 2 types depending on the type of car, and also different locations for the locks themselves. The system must open and close the locks and have a video surveillance system for positioning the working organ that will open the hatch and move back and forth. The operator is located at a distance of 150-250 m and there is also the possibility of manual control next to the mechanism or from a remote control. I am attaching a diagram of the hangar, drawings of the aspiration layout, and analogs of the mechanism from an American manufacturer.
Programming a 5-zone tunnel furnace based on Siemens S7 (setting furnace parameters in HMI, controlling temperature, steam concentration, conveyor speed, exhaust, and safety systems)
There is a preliminary concept for the lifting mechanism of a compact product. Since I am not a design engineer, I cannot assess how optimal the chosen scheme is. It is necessary to: evaluate the proposed concept; if it is viable — refine it; if there is a better solution — propose an alternative option with an explanation of the advantages. Main requirements: compact placement of the mechanism inside the product; synchronous lifting of the lid; possibility of using an electric drive; high reliability; minimal number of parts; preferably, the mechanism should be visually open and look aesthetically pleasing. (brass gears, rack and pinion) I found the most suitable mechanisms and principles for lifting the lid on Pinterest. But I do not have the skills to adapt it to my design. https://www.instagram.com/reel/C5gc3snolm1/?utm_source=ig_web_button_share_sheet In my case, the gears are brass and the pinion lever is thin.
Project Overview: We are finalizing the SHIELD Core V1.2 — a compact (50×40×10 mm) industrial/tactical wearable device. We have a validated engineering architecture, an exploded 3D CAD model, and a finalized component list. We are looking for a senior-level PCB designer who treats signal integrity and thermal management as a religion. Technical Constraints (Non-negotiable): Architecture: 6-Layer HDI (High-Density Interconnect). Fabrication Standard: IPC Class 3. Specific Challenges: Analog Isolation: Dedicated ground stitching for MAX30102 PPG sensor. EMI/Thermal: Massive thermal via arrays under STM32U575 and BQ25185 (PMIC). RF Integrity: 2.4 GHz ceramic chip antenna integration with a full 6-layer keep-out zone. Manufacturing: Via-in-Pad (Type VII) for eMMC and BGA/CSP components (must be filled and capped). What I Expect From You: DFM Mastery: You don't just "draw traces," you design for automated SMT lines. You understand solder mask defined (SMD) pads for BGA/CSP. Portfolio: Please provide at least two examples of your previous 6-layer+ HDI work. If you haven't worked with IPC Class 3 or filled vias, please do not apply. Communication: I need a partner who flags potential issues before the gerbers are sent to the CM, not after. Project Deliverables: KiCad project files. Finalized Gerber set (RS-274X/Excellon) verified against CM’s capability report. Pick & Place (Centroid) file validation. BOM review against current supply chain availability. Why this project? This is a clean-sheet design with zero legacy baggage. You are working with a solid, validated engineering document package. If you are tired of "consumer-grade" projects and want to build industrial-grade hardware that survives the real world, let’s talk. To prove you’ve read this, start your proposal with your favorite thermal management trick for compact sealed enclosures.