Lead PCB Designer Needed: 6-Layer HDI/Mixed-Signal Industrial Wearable (Strict IPC Class 3

Project Overview:

We are finalizing the SHIELD Core V1.2 — a compact (50×40×10 mm) industrial/tactical wearable device. We have a validated engineering architecture, an exploded 3D CAD model, and a finalized component list. We are looking for a senior-level PCB designer who treats signal integrity and thermal management as a religion.

Technical Constraints (Non-negotiable):

Architecture: 6-Layer HDI (High-Density Interconnect).

Fabrication Standard: IPC Class 3.

Specific Challenges:

Analog Isolation: Dedicated ground stitching for MAX30102 PPG sensor.

EMI/Thermal: Massive thermal via arrays under STM32U575 and BQ25185 (PMIC).

RF Integrity: 2.4 GHz ceramic chip antenna integration with a full 6-layer keep-out zone.

Manufacturing: Via-in-Pad (Type VII) for eMMC and BGA/CSP components (must be filled and capped).

What I Expect From You:

DFM Mastery: You don't just "draw traces," you design for automated SMT lines. You understand solder mask defined (SMD) pads for BGA/CSP.

Portfolio: Please provide at least two examples of your previous 6-layer+ HDI work. If you haven't worked with IPC Class 3 or filled vias, please do not apply.

Communication: I need a partner who flags potential issues before the gerbers are sent to the CM, not after.

Project Deliverables:

KiCad project files.

Finalized Gerber set (RS-274X/Excellon) verified against CM’s capability report.

Pick & Place (Centroid) file validation.

BOM review against current supply chain availability.

Why this project?

This is a clean-sheet design with zero legacy baggage. You are working with a solid, validated engineering document package. If you are tired of "consumer-grade" projects and want to build industrial-grade hardware that survives the real world, let’s talk.

To prove you’ve read this, start your proposal with your favorite thermal management trick for compact sealed enclosures.